Nov
15
After Temasek Split, Singapore Chipmaker Faces New Funding Test
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Stats ChipPac plans to issue $400 million of five-year bonds
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Notes may cost 4.5 percent to 5 percent a year: Lucror
Stats ChipPac Ltd., Southeast Asia’s biggest semiconductor assembler, is seeking to refinance $400 million of debt in the first test of its credit strength without the implicit AAA backing of the government of Singapore.
The chip packaging and testing company plans to sell dollar-denominated bonds due in five years to help repay part of an $890 million bridge loan, Chief Financial Officer Woo Kwek Kiong said in an e-mail interview. The company is currently seeking a $500 million syndicated loan to pare the bridge loan from DBS…
After Temasek Split, Singapore Chipmaker Faces New Funding Test
